Power Module/IGBT Module
TEST SOLUTIONS
JF Technology group has the ideal high power elastomer biased rigid style and cantilever style contacting technology through collaborative partnering with customers that are developing extreme leading edge products. To meet the needs of these applications, we expanded our design boundaries to meet high power needs while substantially lowering contact parasitic’ s over other solutions available today for more efficient test and accuracy of results. Technology is solderless surface mount and available in full kelvin, selectable kelvin, and non-kelvin contacting configurations to meet your application needs. Solutions are geared for smooth transition from initial characterization through high-volume production environments through being easily field maintainable
Gamma Family of Contacting Technology
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Cantilever style with X-Direction Off-set Contact technology (IC package and load board ends are not in vertical alignment)
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Available in Full-Kelvin, Dedicated/Selected-Kelvin, and Non-Kelvin configurations
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Optional TCC enables ability to maintain ±2⁰C from set point at DUT during test
Thor Family of Contacting Technology
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Cantilever style with Straight-Thru Contact technology (IC package and load board ends are in vertical alignment)
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Available in multiple electrical lengths
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Available in Full-Kelvin and Non-Kelvin configurations
