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Cantilever Probe Cards

Precision-engineered cantilever probe card solutions designed for reliable, consistent, and high-performance wafer-level semiconductor testing.

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  • 35um pad pitch 

  • Multi site configuration probes

  • Cost effective

  • Fast turn-around time

  • Tungsten, Rhenium Tungsten, Beryllium Copper, Paliney 7

 

300°c Heat Resistance “HR” Technology

  • For WLR (Wafer Level Reliability) testing

  • Minimal thermal expansion

  • Low leakage

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