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Cantilever Probe Cards
Precision-engineered cantilever probe card solutions designed for reliable, consistent, and high-performance wafer-level semiconductor testing.

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35um pad pitch
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Multi site configuration probes
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Cost effective
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Fast turn-around time
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Tungsten, Rhenium Tungsten, Beryllium Copper, Paliney 7
300°c Heat Resistance “HR” Technology
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For WLR (Wafer Level Reliability) testing
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Minimal thermal expansion
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Low leakage
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